Schematic Design
Our company can provide a comprehensive design support from parts investigation
and proposal to circuit data
and
parts list creation,
depending on customers specifications and requests.
Close collaboration with the board design team and the simulation analysis team enables
parallel progression of SI, PI,
and thermal analysis.
Therefore, quick board design is possible without time loss.
In addition, CAD can be selected according to customer's request, and circuit data can be created and provided.
(Circuit editor: CR5000 SystemDesigner, CR8000 DesignGateway, OrCAD)
We have a wealth of experience in designing high-speed communication circuits for vehicles,
such as ADAS and cameras,
and HV inverter circuits.
We will propose specifications and circuit designs that meet the needs of a wide range of customers,
such as 5G high-speed communication and motor drive, for which demand is expected in the future.

Board Design
With our proposal for unique board structures, we realize what standard structures cannot: reduced board area and product volume
Verifying and proposing the optimal board structure for each product

CAD: CR-8000 Design Force (ZUKEN)
*The company and product names listed above are trademarks and registered trademarks of their respective companies.
Rigid flex board and semi-rigid flex boards proposal and design

CAD: CR-8000 Design Force (ZUKEN)
Proposal and designs for PoP, SiP, and modularization

CAD: CR-8000 Design Force (ZUKEN), SiP Layout / OrbitIO (Cadence)
*The company and product names listed above are trademarks and registered trademarks of their respective companies.
Simulation
SI: Signal Integrity
Waveform simulation for impact verification following a trace alteration

Simulator: SIwave (ANSYS), Electronics Desktop (ANSYS)
Batch simulation of all DRAM data bits for more accurate verification

Simulator: Sigrity (Cadence)
*The company and product name listed above are trademarks and registered trademarks of their respective companies.
PI: Power Integrity
Power integrity verification via DC/AC Drop Analysis

Simulator: SIwave (ANSYS), Hspice(Synopsys)
Automated optimization of capacitor use to meet power line target impedances

Simulator: Sigrity (Cadence)
*The company and product names listed above are trademarks and registered trademarks of their respective companies.
Thermal

Output of thermal fluid simulation

Simulator: Icepak (ANSYS), Space Claim (ANSYS)
*The company and product names listed above are the trademarks and registered trademarks of their respective companies.
Our real-time design / simulation environment manifests in the high-speed simulations we run along side our structural design process
Heat structure verification via Discovery Live

The visualization fo thermal flux enables detection
of areas within housing with high thermal resistance
Resin housing
Resin housing with a ventilation hole
Without housing
With aluminum housing